Standards Store. Purchase History. Currency display settings. Manage society memberships. Featured Products. View All Publishers. Quality Management. SCC Standards Store. Popular Standards Bundles. Drawing and Drafting.
Telecommunications Standards. AWS D1. Means, Inc. Active Only. Look Inside. Complete Document. Detail Summary View all details. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved.
The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Committee s : JC , JC The purpose of this standard is to establish an agreed set of worst case solder process limits SnPb and Pb-free which can safely be used for assembling non-semiconductor electronic components on common substrates, e.
The lead organization is ECIA. This document identifies the classification level of nonhermetic solid-state surface mount devices SMDs that are sensitive to moisture-induced stress.
It is used to determine what classification level should be used for initial reliability qualification. This revision now covers components to be processed at higher temperatures for lead-free assembly. This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. It is an invaluable resource for use by suppliers, board fabricators, electronics manufacturing service EMS providers and original equipment manufacturers OEMs.
The tool also allows for modification of dimensional attributes of IPC approved land patterns. Soldering flux materials include the following: A must for all quality assurance and assembly departments, IPC-AF illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations.
The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.
The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards. The IPC is supplemented by the appropriate sectional performance specification: IPC-SM — Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Se indholdsfortegnelse her Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system.
The immersion tin Sn is a metallic finish deposited by a chemical displacement reaction that is applied directly to the basis metal of the printed board, which is copper.
This website uses cookies to improve your experience while you navigate through the website. Out of these cookies, the cookies that are categorized as necessary are stored on your browser as they are as essential for the working of basic functionalities of the website.
We also use third-party cookies that help us analyze and understand how you use this website. These cookies will be stored in your browser only with your consent. You also have the option to opt-out of these cookies. But opting out of some of these cookies may have an effect on your browsing experience. Necessary cookies are absolutely essential for the website to function properly.
This category only includes cookies that ensures basic functionalities and security features of the website. These cookies do not store any personal information. Menu Home.
0コメント